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MT Series Reed Relay

The MT Series is a high-density surface-mount reed relay engineered for advanced differential switching in automated test equipment (ATE) and high-frequency signal routing. Designed with a changeover-like form and compact SMT packaging, the MT Series offers a 25% reduction in assembly space compared to legacy designs, making it ideal for dense pin-electronics layouts and functional PCB test systems.

Available in 1 and 2 Form C (A+B) contact configurations, the MT Series supports coil voltages of 3.3 VDC, 5 VDC, and 12 VDC, and is rated for up to 10 W, 100 VDC, and 0.5 A. With RF performance up to 4 GHz, 50Ω impedance, and reliability exceeding 300 million operations, it delivers exceptional performance in high-frequency and high-reliability environments. Mounting options include Gull-Wing and J-Lead styles for flexible PCB integration.

  • High-density SMT design with 25% space savings
  • Contact configurations: 1 Form C, 2 Form C (A+B)
  • Rated for 10 W, 100 VDC, and 0.5 A switching capacity
  • Coil voltage options: 3.3 VDC, 5 VDC, and 12 VDC
  • RF performance: Up to 4 GHz with 50Ω impedance
  • Insertion loss: –3 dB drop-off point at ~4 GHz
  • Mounting options: Gull-Wing and J-Lead surface-mount packages
  • Reliability: >300 million operations
  • Optimized for differential switching in ATE environments
Coil Voltage (VDC)3.3, 5, 12
Coil Resistance (Ω) Max.150
Contact Form1T, 2T, 1A+1B
Rated Power Max.10W/100VDC/0.5A
Insertion Loss -3dB drop off point GHz~ 4 GHz
Life Expectancy (at 1V 10mA)Life Expectancy (at 1V 10mA)
  • Automated Test Equipment (ATE): Differential switching in pin-electronics
  • Functional PCB Testing: Compact relay arrays for signal routing
  • Data Acquisition Systems: High-frequency relay integration
  • Telecommunications: RF switching in wireless modules
  • IC Wafer Testing: Precision switching in high-density layouts
  • Wireless Communications: Reliable RF performance in compact designs

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